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China MCCB Mental Stamping Moulding Connection Plate - Quality from Leading Suppliers and Factory
Processing efficiency of low-speed WEDM
(1) High processing efficiency
Due to the development of NS class high peak current pulse power supply technology and detection, control and anti-interference technology, the processing efficiency of low-speed WEDM is also improving.
(2) Processing efficiency of workpieces with large thickness
When cutting 300 mm thick workpiece, the processing efficiency can reach 170 mm2/min, which is a very significant technical improvement.
(3) Processing efficiency of workpiece with thickness change
It can automatically detect the thickness of the workpiece and automatically adjust the processing parameters to prevent wire breakage, and achieve high processing efficiency in this state.
Frequently Asked Questions
The continuous improvement in low-speed WEDM processing efficiency is driven by the development of NS class high peak current pulse power supply technology, along with advanced detection, control, and anti-interference technologies.
When cutting a workpiece with a large thickness of 300 mm, the processing efficiency can reach up to 170 mm²/min, marking a highly significant technical advancement.
The system automatically detects changes in the thickness of the workpiece and dynamically adjusts the processing parameters in real-time to maintain optimal performance.
By automatically sensing thickness variations and instantly adjusting the processing parameters, the system effectively prevents wire breakage while preserving high processing efficiency.
Yes, the development of NS class high peak current pulse power supply technology is one of the primary reasons for the improved processing efficiency of low-speed WEDM.
